![]() ![]() The length of welding ribbon is about double length of cell side. The hot source of welding is an infrared light ( it exploits the heat effect of infrared). It is to weld bus bar on the frontside of solar cells (Positive Pole), busbar is tinning copper ribbon, the welding machine can weld solder ribbon on the main busbar by multipoint method. The cells test is to test their current and voltage, then classify them, to improve the use ratio of solar cells, then make quality conformance solar modules.Ģ) Front Welding. As the manufacturing condition of solar cells is randomness, the cells performance has some difference, in order to group the solar cells which have the same or close performance, they need be classified according to their performance parameter. ![]() High quality and long lifespan products are the key factor to get clients’ satisfaction, so, the encapsulation quality of solar panel is very important.ġ) Solar Cells Test. The encapsulation of solar cells not only can guarantee the lifespan of solar cells, but also can enhance the resistance ability. Even better solar cells can’t produce better solar panel if don’t have better encapsulation technique. Module line is also said as encapsulation line, encapsulation is the core process during production of solar module. The manufacturing process of solar panel. Test to classify according to specified parameter specification.Ĥ. ![]() Sintering Cell Chip on the baseplate of nickel or copper.ġ0) The Test Step. The technique method includes Vacuum Coating, Ion Plating, Sputtering, Printing, PECVD or Spraying, etc.ĩ) Sintering. The materials which are being adopted to make antireflection film include MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta205, etc. In order to reduce the loss of lighting reflection, it need cover a layer of antireflection film on the surface of silicon wafer. The aluminum paste printing is the technique which is the most adopted.Ĩ) Making Antireflection Film. Use vacuum evaporation, chemical nickel-plating or aluminum slurry printing and sintering, to make the bottom electrode at first, then to make the top electrode. Usually, Wet Etching or Grinding Method are adopted to wipe out PN+ Junction of backside.ħ) Making Top and Bottom Electrode. The diffusion layer which is formed on the surrounding surface of silicon wafer when making diffusion, would make short circuit on the top and bottom electron, need use masked wet corrosion or dry plasma etching to wipe out the surrounding diffusion layer.Ħ) Wiping out PN+ junction of backside. Adopt coated source or liquid source or solid nitrogen phosphor plate source to diffuse and produce PN+ junction, the deep of junction is about 0.3~0.5um.ĥ) Surrounding the corrosion. Use aqueous alkali to make various different erosion on the surface of silicon wafer to produce suede.Ĥ) Phosphorus Diffusion. To use normal wafer cleaning method to clean, then use acid or alkali solution to wipe out 30-50um of cutting damage layer on the surface of silicon wafer.ģ) Produce Suede. To adopt multi-line cutting, cutting silicon rods into square wafer.Ģ) Cleaning. The specific manufacturing process is as below:ġ) Slicing. It is the developing mainstream of solar cells technology to improve conversion rate of solar cells and decrease cost. The manufacturing process of crystalline silicon solar cells is as below diagram. The manufacturing technique for solar cells. ![]()
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